NDLI: A 232-channel retinal vision prosthesis with a miniaturized hermetic package

Content Provider	IEEE Xplore Digital Library
Author	Ordonez, J.S. Schuettler, M. Ortmanns, M. Stieglitz, T.
Copyright Year	2012
Description	Author affiliation: Inst. of Microelectron., Ulm Univ., Ulm, Germany (Ortmanns, M.) \|\| Dept. of Microsyst. Eng.., Univ. of Freiburg, Freiburg, Germany (Ordonez, J.S.; Schuettler, M.; Stieglitz, T.)
Abstract	Miniaturization of implantable devices while drastically increasing the number of stimulation channels is one of the greatest challenges in implant manufacturing because a small but hermetic package is needed that provides reliable protection for the electronics over decades. Retinal vision prostheses are the best example for it. This paper presents a miniaturized 232-channel vision prosthesis, summarizing the studies on the individual technologies that were developed, improved and combined to fabricate a telemetrically powered retinal device sample. The implantable unit, which is made out of a high temperature co-fired alumina ceramic package containing hermetic feedthroughs, electronic circuitry and a radio frequency coil for powering is manufactured through a modified screen-printing/lasering process. The package is sealed with solder glass to provide unaffected inductive coupling to the telemetric transmitter. A 0.05 cc inner volume allows helium leak testing and mathematical lifetime estimations for moisture-induced failure of up to 100 years. The feedthroughs contact a thin-film polyimide electrode array that utilizes DLC and SiC coatings for improved interlayer adhesion of the metallic tracks to the polymer carrier. Two metal layers allow integrated wiring of the electrode array within the very limited space.
Sponsorship	IEEE Eng. Medicine Biol. Soc.
Starting Page	2796
Ending Page	2799
File Size	1655874
Page Count	4
File Format	PDF
ISBN	9781424441198
ISSN	1557170X
e-ISBN	9781457717871
DOI	10.1109/EMBC.2012.6346545
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-08-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Electrodes Arrays Polyimides Fabrication Implants Coils
Content Type	Text
Resource Type	Article
Subject	Signal Processing Biomedical Engineering Health Informatics Computer Vision and Pattern Recognition

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