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Content Provider | IEEE Xplore Digital Library |
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Author | Cheney, M.E. Fitch, R.C. Robinson, G.D. Huang, C.I. Neidhard, R.A. |
Copyright Year | 1991 |
Description | Author affiliation: Wright Lab., Wright-Patterson AFB, OH, USA (Cheney, M.E.; Fitch, R.C.) |
Abstract | The feasibility of peeling the active AlGaAs/GaAs heterojunction bipolar transistor (HBT) epitaxial thin films from the original GaAs substrate and the subsequent van der Waals bonding of the films to AlN, InP and diamond on silicon substrates is discussed. HBTs were first fabricated on epitaxial layers containing an AlAs separating layer. The wafer was divided, and a portion of the wafer was then peeled and van der Waals bonded to various substrates. The van der Waals bond demonstrated excellent thermal and mechanical stability by withstanding subsequent processing steps up to 250 degrees C. The lifted devices bonded to the higher thermal conductivity substrates show excellent DC and RF performance. The average device junction temperature was also characterized. Further improvements can be accomplished by utilizing substrates with a smooth surface morphology having a high thermal conductivity. |
Starting Page | 334 |
Ending Page | 337 |
File Size | 213004 |
Page Count | 4 |
File Format | |
ISBN | 0780304918 |
DOI | 10.1109/CORNEL.1991.170002 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1991-08-05 |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Substrates Wafer bonding Thermal conductivity Gallium arsenide Heterojunction bipolar transistors Semiconductor thin films Thin film transistors Semiconductor films Indium phosphide Silicon |
Content Type | Text |
Resource Type | Article |
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