NDLI: Microassembly technologies for MEMS components on flexible substrates

Content Provider	IEEE Xplore Digital Library
Author	Sieber, A. Houston, K. Dario, P. Woegerer, C.
Copyright Year	2009
Abstract	The paper describes the development of a microassembly station for mounting MEMS components on a flexible substrate. The core components are a micro hotplate mounted on a xy stage and a suction gripper with an integrated force sensor carried by a nanoslider (1DOF in z-Axis). A syringe with a 30 gauge needle, mounted on a PC controllable 3DOF micromanipulator, is driven by a microdispenser. Two micro cameras allow a precise alignment of the sensor on the substrate. The whole set up is PC controlled under Labview 8.5 [National Instruments]. The station allows processing of soldering paste, conductive glues and anisotropic conductive tape. Bonding trials with solder paste and conductive glues failed. The 3M Film 5552R showed best performances with low resistance electrical connections and with reliable mechanical bondings. Contact resistances below 0.5 Ω were achieved. Additionally the overall process time is very low in comparison to other processes.
Starting Page	383
Ending Page	386
File Size	11947496
Page Count	4
File Format	PDF
ISBN	9781424446278
DOI	10.1109/ISAM.2009.5376973
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-11-17
Publisher Place	South Korea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Micromechanical devices Substrates Bonding Grippers Force sensors Needles Micromanipulators Cameras Instruments microassembly anisotropic film flexible substrate MEMS
Content Type	Text
Resource Type	Article

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