NDLI: Interdependent Intermetallic Compound Growth in an Electroless Ni-P/Sn-3.5Ag Reaction Couple

Content Provider	SpringerLink
Author	Kumar, Aditya Chen, Zhong
Copyright Year	2010
Abstract	The interfacial microstructure of electroless Ni-P/Sn-3.5Ag solder joints was investigated after reflow and high-temperature solid-state aging to understand its interdependent growth mechanism and related kinetics of intermetallic compounds (IMCs) at the interface. The reflow and aging results showed that mainly three IMC layers, Ni$_{3}$Sn$_{4}$, Ni$_{2}$SnP, and Ni$_{3}$P, formed during the soldering reaction. It was found that the Ni$_{3}$Sn$_{4}$ and Ni$_{3}$P layers grow predominantly as long as the electroless Ni-P layer is present; however, once the Ni-P layer is fully consumed, the Ni$_{2}$SnP layer grows rapidly at the expense of the Ni$_{3}$P layer. A transition in the Ni$_{3}$Sn$_{4}$ morphology from needle and chunky shape to scallop shape was observed after the solid-state aging of reflowed samples. The kinetics data obtained from the growth of compound layers in the aged samples revealed that initially the growth of the Ni$_{2}$SnP layer is controlled by diffusion, and subsequently by the rate of reaction after the Ni-P metallization is fully consumed. It was found that complete transformation of the electroless Ni-P layer into a Ni$_{3}$P layer results in the rapid growth of the Ni$_{2}$SnP layer due to the dominating reaction of Sn with Ni$_{3}$P. The apparent activation energies for the growth of Ni$_{3}$Sn$_{4}$, Ni$_{2}$SnP, and Ni$_{3}$P compound layers were found to be 98.9 kJ/mol, 42.2 kJ/mol, and 94.3 kJ/mol, respectively.
Starting Page	213
Ending Page	223
Page Count	11
File Format	PDF
ISSN	03615235
Journal	Journal of Electronic Materials
Volume Number	40
Issue Number	2
e-ISSN	1543186X
Language	English
Publisher	Springer US
Publisher Date	2010-12-15
Publisher Place	Boston
Access Restriction	Subscribed
Subject Keyword	Electroless Ni-P intermetallic compound lead-free solders kinetics interfacial reaction under bump metallization ENIG Solid State Physics Electronics and Microelectronics, Instrumentation Characterization and Evaluation of Materials Optical and Electronic Materials
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Materials Chemistry Electrical and Electronic Engineering

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