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Content Provider | IEEE Xplore Digital Library |
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Author | Elmessary, M.A. Nagy, D. Aldegunde, M. Lindberg, J. Dettmer, W.G. Peric, D. Garcia-Loureiro, A.J. Martinez, A. Kalna, K. |
Copyright Year | 2014 |
Description | Author affiliation: ESDC, Swansea Univ., Swansea, UK (Elmessary, M.A.; Nagy, D.; Aldegunde, M.; Martinez, A.; Kalna, K.) || H.H. Wills Phys. Lab., Univ. of Bristol, Bristol, UK (Lindberg, J.) || C2EC, Swansea Univ., Swansea, UK (Dettmer, W.G.; Peric, D.) || CITIUS, Univ. de Santiago de Compostela, Santiago de Compostela, Spain (Garcia-Loureiro, A.J.) |
Abstract | SOI Si FinFETs scaled to gate lengths of 12.8 nm, 10.7 nm and 8.1 nm are simulated using 3D Finite Element Monte Carlo simulations with 2D Schrödinger based quantum corrections considering two cross-sections: rectangular and triangular, with rounded corners, in the preferred (110) channel orientation. The rectangular FinFETs give larger drive currents per perimeter than the triangular FinFETs but are outperformed by the triangular ones when normalised by channel area. In the scaling process, the drive current increases by about 5% (4%) and 5% (1%) for rectangular (triangular) cross-sections with nearly ideal sub-thresholds of 72 (66) mV/dec. The effect of interface roughness increases during the scaling from 3% to 12% and affects stronger the triangular cross-section FinFETs. |
Starting Page | 97 |
Ending Page | 100 |
File Size | 645834 |
Page Count | 4 |
File Format | |
ISBN | 9781479937189 |
DOI | 10.1109/ULIS.2014.6813925 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2014-04-07 |
Publisher Place | Sweden |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Solid modeling Three-dimensional displays Monte Carlo methods Monte Carlo Schro¨dinger equation FinFET Logic gates FinFETs Silicon Mathematical model Finite Elements |
Content Type | Text |
Resource Type | Article |
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