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Content Provider | IEEE Xplore Digital Library |
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Author | Thamm, S. Kochetov, S.V. Wollenberg, G. Leone, M. |
Copyright Year | 2007 |
Description | Author affiliation: Inst. for Fundamental Electr. Eng. & Electromagn. Compatibility, Otto-von-Guericke Univ. Magdeburg, Magdeburg (Thamm, S.; Kochetov, S.V.; Wollenberg, G.; Leone, M.) |
Abstract | This paper deals with the modeling of arbitrary oriented interconnection structures with the method of partial elements regarding EMC simulations of power electronics. 1D and 2D PEEC models were developed, implemented and tested as well in the simulation tool Ansoft $Simplorer^{reg}$ as in SPICE. An alternative approach for the PEEC modeling is used to overcome the huge simulation effort in real conductor arrangements because of the high number of inductive and ca-pacitive couplings. The coupling matrices of this kind of PEEC models are diagonal dominant and matrix sparsification by truncation methods can be used without loss of passivity of the interconnections. The application of the developed PEEC models is shown for two examples. |
Starting Page | 1 |
Ending Page | 5 |
File Size | 4276154 |
Page Count | 5 |
File Format | |
ISBN | 1424408210 |
DOI | 10.1109/RADIOELEK.2007.371704 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2007-04-24 |
Publisher Place | Czech Republic |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Circuit simulation Integrated circuit interconnections Electromagnetic compatibility Conductors Power electronics EMC simulation power electronics Integral equations Coupling circuits PEEC SPICE Capacitance Equivalent circuits |
Content Type | Text |
Resource Type | Article |
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