NDLI: Experimental thermal study of a TET system for implantable biomedical devices

Content Provider	IEEE Xplore Digital Library
Author	Dissanayake, T.D. Budgett, D. Patrick Hu Malpas, S.
Copyright Year	2008
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Univ. of Auckland, Auckland (Patrick Hu) \|\| Telemetry Res. Ltd., Auckland (Malpas, S.) \|\| Bioeng. Inst., Univ. of Auckland, Auckland (Dissanayake, T.D.; Budgett, D.)
Abstract	Power can be transferred across the skin using time varying magnetic fields to energize implantable medical devices. One of the most important concerns is the temperature rise caused by power loss and heating of such TET (Transcutanoues Energy Transfer) systems. This paper presents an experimental study of a TET system implanted in a sheep. The temperature rise in the internal and external coils of a TET system is analysed for power delivery in the 7W to 25W range. A power loss analysis of the overall system for three different loading conditions has been carried out and comparisons are presented. The TET system presented operates with an efficiency of 80.5% and a temperature rise of 2degC was observed in the implanted secondary coil when delivering 7W of power to the load.
Starting Page	113
Ending Page	116
File Size	365131
Page Count	4
File Format	PDF
ISBN	9781424428786
DOI	10.1109/BIOCAS.2008.4696887
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Coils Temperature efficiency Energy exchange Biological tissues Blood magnetic filed Transcutaneous Energy Transfer (TET) Implantable biomedical devices Thermal conductivity Skin Power generation Heat transfer
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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