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Content Provider | IEEE Xplore Digital Library |
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Author | Quay, R. van Raay, F. Kuhn, J. Kiefer, R. Waltereit, P. Zorcic, M. Musser, M. Bronner, W. Dammann, M. Seelmann-Eggebert, M. Schlechtweg, M. Mikulla, M. Ambacher, O. Thorpe, J. Riepe, K. van Rijs, F. Saad, M. Harm, L. Rodle, T. |
Copyright Year | 2008 |
Description | Author affiliation: NXP Semicond., Nijmegen, Netherlands (van Rijs, F.; Saad, M.; Harm, L.; Rodle, T.) || Fraunhofer Inst. for Appl. Solid-State Phys., Freiburg, Germany (Quay, R.; van Raay, F.; Kuhn, J.; Kiefer, R.; Waltereit, P.; Zorcic, M.; Musser, M.; Bronner, W.; Dammann, M.; Seelmann-Eggebert, M.; Schlechtweg, M.; Mikulla, M.; Ambacher, O.) || United Monolithic Semicond., Ulm, Germany (Thorpe, J.; Riepe, K.) |
Abstract | This paper describes efficient GaN/AlGaN HEMTs and MMICs for L/S-band (1-4 GHz) and X-band frequencies (8-12 GHz) on three-inch s.i. SiC substrates. Dual-stage MMICs in microstrip transmission-line technology yield a power-added efficiency of ¿40% at 8.56 GHz for a power level of ¿11 W. A single-stage MMIC yields a PAE of ¿55% with 6 W of output power at $V_{DS}=$ 20 V. The related mobile communication power HEMT process yields an average power density of 10 W/mm at 2 GHz and $V_{DS}=$ 50 V. The average PAE is 61.3% with an average linear gain 24.4 dB and low standard deviation of all parameters. The devices yield more than 25 W/mm of output power at 2 GHz when operated in cw at $V_{DS}=$ 100 V with an associated PAE of ¿60%. The GaN HEMT process with 0.5 ¿m gate-length yields an extrapolated lifetime of $10^{5}$ h when operated at $V_{DS}=$ 50 V at a channel temperature of 90°C. When operated at 2 GHz devices with 480 ¿m gate-width yield a change of the RF power-gain of less than 0.2 dB under high gain-compression at $V_{DS}=$ 50 V and a channel temperature of 250°C. |
Starting Page | 87 |
Ending Page | 90 |
File Size | 964154 |
Page Count | 4 |
File Format | |
ISBN | 9782874870071 |
DOI | 10.1109/EMICC.2008.4772235 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2008-10-27 |
Publisher Place | Netherlands |
Access Restriction | Subscribed |
Rights Holder | European Microwave Assoc. |
Subject Keyword | Temperature Silicon carbide Power amplifiers HEMTs MMICs Frequency Microstrip Gallium nitride Aluminum gallium nitride Power generation |
Content Type | Text |
Resource Type | Article |
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