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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hunziker, M. Horst, G. |
| Copyright Year | 2008 |
| Description | Author affiliation: Atotech Germany GmbH (Hunziker, M.; Horst, G.) |
| Abstract | $VIALAM^{reg}$ Series, manufactured by Atotech's Advanced Epoxy Powder Technology are high performance build-up materials for HDI and IC Packaging industries. The manufacturing technology exclusively employs dry powder formulations without the need for costly and environmentally impacting organic solvents. In addition it allows for a greater manufacturing and formulation flexibility in creating dielectric resins of precise electrical, physical and mechanical properties better attuned to the needs of electronics designers and PWB manufacturers Atotech's process, in contrast to the conventional liquid coating process, utilizes an extruded dielectric resin, which is milled and then applied onto the foil, with the resin always in a dry powder form. The foil then passes through a melting step that converts the dry powder into a "B" staged homogeneous coating fully ready for use at the customer. In addition Atotech has developed the technology to reinforce the coated foil with woven glass fabrics to fulfill the market needs for ultra thin reinforced substrates with low CTE (coefficient of thermal expansion) values and highest reliability. The paper will address material properties achieved through this innovative manufacturing technology. |
| Starting Page | 344 |
| Ending Page | 347 |
| File Size | 4070857 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424436231 |
| DOI | 10.1109/IMPACT.2008.4783882 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-10-22 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Manufacturing industries Solvents Powders Manufacturing processes Dielectric materials Mechanical factors Integrated circuit packaging Coatings Resins Dielectric liquids |
| Content Type | Text |
| Resource Type | Article |
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