Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chien-Chia Chiu Chung-Jung Wu Chih-Tang Peng Kuo-Ning Chiang Ku, T. Cheng, K. |
| Copyright Year | 2006 |
| Description | Author affiliation: Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu (Chien-Chia Chiu; Chung-Jung Wu; Chih-Tang Peng; Kuo-Ning Chiang; Ku, T.; Cheng, K.) |
| Abstract | As is well known, the design parameters of the packaging material and structure greatly influences the reliability of the packaging. When it comes to flip chip packages, the feeling is that it are the parameters that cause the complicacy of the package reliability design. In addition, the interactions between these different design parameters remain unclear, especially for the lead-free solder applications. Based on the above, the FEM factorial analysis was employed in this research to investigate the interrelationship of the design parameters. The factorial design method was repeated twice with two solder materials (63Sn/37Pb and 96.5Sn/3.5Ag). The findings show that the structures with a larger BT core thickness, a thicker pre-solder layer and a higher bump height have a better solder bump reliability. In terms of the factorial analysis, the BT core thickness was the factor having the most influence on reliability. The interactions between the factors were observed in this study |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 5394375 |
| Page Count | 4 |
| File Format | |
| ISBN | 1424407346 |
| DOI | 10.1109/IMPACT.2006.312215 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-10-18 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Environmentally friendly manufacturing techniques Design methodology pre-solder structure factorial analysis Fatigue Flip chip Finite element methods Electronics industry Lead Tin Soldering lead-free flip chip Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|