NDLI: Multi-layered SiC microchannel heat sinks

Content Provider	IEEE Xplore Digital Library
Author	Skandakumaran, P. Ortega, A. Jamal-Eddine, T. Vaidyanathan, R.
Copyright Year	2004
Description	Author affiliation: Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA (Skandakumaran, P.; Ortega, A.; Jamal-Eddine, T.)
Abstract	This work describes the heat transfer in a novel class of multi-layered microchannel heat sinks manufactured from SiC using an extrusion freeform fabrication (EFF) technique. EFF permits the fabrication of geometrically complex, three-dimensional structures in non-traditional materials. In this paper, experimental data is compared with a closed-form analytical solution for single and multi-layered channels. It is found that multi-layer heat sinks have lower thermal resistance compared to single layer samples, and this improvement in performance increases with thermal conductivity of the heat sink material. Additionally, for fixed overall flow rate, increasing the number of layers has the benefit of reducing the overall pressure drop, despite the reduction in the per-channel flow rate. The analytical solution shows that unit thermal resistance R" (/spl deg/C/(W/cm/sup 2/)) of order 0.05 can be achieved with two layers of channels with diameter of order 100 /spl mu/m.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Inst. of Elec. and Electron. Eng
Starting Page	352
Ending Page	360
File Size	763998
Page Count	9
File Format	PDF
ISBN	0780383575
DOI	10.1109/ITHERM.2004.1319196
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon carbide Microchannel Heat sinks Thermal resistance Thermal conductivity Heat transfer Fabrication Conducting materials Resistance heating Manufacturing
Content Type	Text
Resource Type	Article

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