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Content Provider | IEEE Xplore Digital Library |
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Author | Tilford, T. Sinclair, K.I. Goussetis, G. Bailey, C. Desmulliez, M.P.Y. Parrott, A.K. Sangster, A.J. |
Copyright Year | 2008 |
Description | Author affiliation: Centre for Numerical Modelling & Process Anal., Univ. of Greenwich, London (Tilford, T.) |
Abstract | Curing of encapsulant material in a simplified microelectronics package using an open oven Variable Frequency Microwave (VFM) system is numerically simulated using a coupled solver approach. A numerical framework capable of simulating electromagnetic field distribution within the oven system, plus heat transfer, cure rate, degree of cure and thermally induced stresses within the encapsulant material is presented. The discrete physical processes have been integrated into a fully coupled solution, enabling usefully accurate results to be generated. Numerical results showing the heating and curing of the encapsulant material have been obtained and are presented in this contribution. The requirement to capture inter-process coupling and the variation in dielectric and thermophysical material properties is discussed and illustrated with simulation results. |
Starting Page | 1 |
Ending Page | 8 |
File Size | 858795 |
Page Count | 8 |
File Format | |
ISBN | 9781424421275 |
DOI | 10.1109/ESIME.2008.4525086 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2008-04-20 |
Publisher Place | Germany |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Numerical simulation Curing Frequency Electromagnetic heating Microwave ovens Thermal stresses Microelectronics Packaging Electromagnetic fields Heat transfer |
Content Type | Text |
Resource Type | Article |
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