NDLI: Thales components and technologies for T / R modules

Content Provider	IEEE Xplore Digital Library
Author	Mancuso, Y.
Copyright Year	2008
Description	Author affiliation: Thales Syst. Aeroportes, Elancourt (Mancuso, Y.)
Abstract	This paper presents new developments and perspectives in phased arrays radars and electronic warfare for the next generations of T/R modules (medium/long term), in order to decrease the mass production cost, while increasing the level of performance and reliability. In terms of physical architecture, even if the brick one is more current at mid-term, the tile concept is investigated for conformal and/or multifunction phased array antennas : a 3-dimension module will lead to a drastic reduction of size and weight of the antenna. MMICs are always the key components, with evolutions towards multifunction chips, new processes like GaN,SiGe, MEMS power switches. Concerning the packaging, a technological roadmap indicates the different capabilities : thick film multilayer ceramic circuits, co-fired ceramics based on LTCC or HTCC processes, surface-mounted packages on printed circuits boards and 3D architectures. The interconnection domain is also now more and more important in order to be compatible with the level of integration required for the microwave modules : fuzz buttons, flex, sub-miniature connectors. All these technologies mastered by Thales are dual for airborne and space, military and civilian applications.
Starting Page	1
Ending Page	5
File Size	619616
Page Count	5
File Format	PDF
ISBN	9781424415380
ISSN	10975659
DOI	10.1109/RADAR.2008.4720829
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-26
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Phased arrays Packaging Ceramics Space technology Radar Electronic warfare Mass production Costs Tiles Antenna arrays
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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