NDLI: Thermal flow sensors based on printed circuit board technology

Content Provider	IEEE Xplore Digital Library
Author	Sauter, T. Glatzl, T. Kohl, F. Steiner, H. Talic, A.
Copyright Year	2014
Description	Author affiliation: Center of Integrated Sensor Syst., Danube Univ. Krems, Wiener Neustadt, Austria (Sauter, T.; Glatzl, T.; Kohl, F.; Steiner, H.; Talic, A.)
Abstract	Measurement of air flows is an important task in many process monitoring systems. In applications like control of ventilation and air conditioning systems, robustness, ease of use, and cost are important issues calling for simple and effective sensor design. This paper investigates the use of commercial-off-the-shelf printed circuit board technologies for the fabrication of calorimetric flow sensors. Such sensors are known to be sensitive when being implemented using thin-film technology. The paper reviews the operation principle of thermal flow sensors and their performance in micromachined silicon technology for comparison. Subsequently, a similar design is introduced where heating and temperature sensing elements are made from standard copper traces on a flexible PCB substrate. Simulation studies demonstrate the basic viability of this approach, even if it might entail some performance penalties. First experimental data of sensor prototypes show that the repeatability of the PCB manufacturing processes is basically sufficient for using copper traces as sensors, but leaves also room for future improvement in both technology and sensor design.
Starting Page	748
Ending Page	753
File Size	562166
Page Count	6
File Format	PDF
e-ISBN	9781479939466
DOI	10.1109/ISQED.2014.6783402
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-03-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature sensors Temperature measurement Heating Copper Thermistors HVAC monitoring Thermal sensor flow sensor thin-film technology PCB technology
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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