NDLI: Comparison of encapsulant curing with convection and microwave systems

Content Provider	IEEE Xplore Digital Library
Author	Tilford, T. Sinclair, K.I. Goussetis, G. Bailey, C. Desmulliez, M.P.Y. Parrott, A.K. Sangster, A.J.
Copyright Year	2008
Description	Author affiliation: Microsyst. Eng. Centre (MISEC), Heriot Watt Univ., Edinburgh, UK (Sinclair, K.I.; Goussetis, G.; Desmulliez, M.P.Y.; Sangster, A.J.) \|\| Centre for Numerical Modelling & Process Anal. (CNMPA), Univ. Of Greenwich, London, UK (Tilford, T.; Bailey, C.; Parrott, A.K.)
Abstract	Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convection and microwave cure processes has been developed and is briefly outlined. The model is used to analyse the curing of a commercially available encapsulant material using both systems. Results obtained from numerical solutions are presented, confirming that the VFM system enables the cure process to be carried out far more rapidly than with the convection oven system. This capability stems from the fundamental heating processes involved, namely that microwave processing enables the heating rate to be varied independently of the material temperature. Variations in cure times, curing rates, maximum temperatures and residual stresses between the processes are fully discussed.
Starting Page	1
Ending Page	6
File Size	213921
Page Count	6
File Format	PDF
ISBN	9781424433926
ISSN	10898190
e-ISBN	9781424433933
DOI	10.1109/IEMT.2008.5507869
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-04
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Curing Electromagnetic heating Temperature Microwave ovens Dielectric materials Infrared heating Electromagnetic coupling Finite difference methods Polymers Conducting materials
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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