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Content Provider | IEEE Xplore Digital Library |
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Author | Qiang Ling Jian Cai Shuidi Wang Huiyou Zhao |
Copyright Year | 2007 |
Description | Author affiliation: China Univ. of Min. & Technol., Beijing (Qiang Ling; Huiyou Zhao) |
Abstract | NiMoP is one of the most important barrier layers for Cu interconnection. A pretreatment for initiating electroless plating on $Si/SiO_{2}$ based on palladium ion grains chemisorption on self-assembled monolayers (SAMs) of amidogen of silane coupling agent has been developed. The process and properties of electroless plating NiP/NiMoP compound thin films on $Si/SiO_{2}$ substrate have been investigated. When concentration ratios of $[MoO_{4}$ $^{2-}]/[Ni^{2+}]$ is at 0.02-0.1, atom percent of phosphoric in NiMoP layer is about 4%, and the NiMoP film has typical mixed-crystal structure consist of the crystal Ni phase and the non-crystal Mo phase. The grain size is about 50nm. The NiMoP film has diffusion barrier effect at high temperatures up to 400degC. The adhesion with the surface of $SiO_{2}/Si$ can be improved obviously by adding NiP transition layer and 200degC annealing treatment in nitrogen atmosphere. The NiP/NiMoP compound thin films exhibit high integrality and uniformity, good neatness degree, low surface roughness, strong adhesion and low resistivity. In all, NiMoP barrier layer has a potential use for preventing copper-to- silicon diffusion for the application of 3D packaging with TSVs. |
Starting Page | 1 |
Ending Page | 5 |
File Size | 953492 |
Page Count | 5 |
File Format | |
ISBN | 9781424413911 |
DOI | 10.1109/ICEPT.2007.4441459 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2007-08-14 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Sputtering Grain size Adhesives Rough surfaces Surface roughness Surface treatment Copper Palladium Semiconductor thin films Substrates |
Content Type | Text |
Resource Type | Article |
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