NDLI: Design and Characterization of Wafer Level SAW Filter Package Using LT-LT Wafer Structure

Content Provider	IEEE Xplore Digital Library
Author	Tae Hoon Kim Won Kyu Jeung Si Joong Yang Seog Moon Choi Mi Jin Park Jang Ho Park Sung Yi Jun Sik Hwang Ji Hyuk Lim Woon Bae Kim
Copyright Year	2006
Description	Author affiliation: Inst. of Manuf. Eng. R&D, Samsung Electro-Mech. Co., Ltd., Suwon (Tae Hoon Kim; Won Kyu Jeung; Si Joong Yang; Seog Moon Choi; Mi Jin Park; Jang Ho Park; Sung Yi)
Abstract	Miniaturization is one of the driving design goals for large number of wireless applications, especially mobile phones. These market trends call for more thin and small size components with high reliability performance. In this paper, we describes the wafer level surface acoustic wave (SAW) filter package, 1.0 times 0.8 $mm^{2},$ which is applicable for radio frequency (RF) stage in mobile phones. The SAW filter is reduced in size and thickness by using a 4" wafer level package process technique. The technique uses interconnection via and $LiTaO_{3}$ $(LT)-LiTaO_{3}$ (LT) wafer bonding structure. The interconnection via is formed through LT wafer by using sand blasting or laser drilling method. The AuSn eutectic bonding enables the connection of the signal pad on the SAW chip, with gold metallized LT wafer package. This eutectic bonding ensures that the SAW chip is protected mechanically and connected electrically, with the package. In order to simulate and optimize the structure and characteristics of wafer level SAW filter package, we used HFSS and ADS software. Frequency responses of measurement and simulation are compared with wafer level SAW filter package. The results of reliability tests for wafer level SAW filter package was discussed.
Starting Page	1
Ending Page	5
File Size	2034568
Page Count	5
File Format	PDF
ISBN	9781424408337
DOI	10.1109/EMAP.2006.4430597
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-12-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	SAW filters Wafer scale integration Packaging Surface acoustic waves Wafer bonding Mobile handsets Radio frequency Acoustic waves Drilling Gold
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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