NDLI: Energy based failure criterion for interfacial delamination [IC packaging]

Content Provider	IEEE Xplore Digital Library
Author	Chung, P.W.K. Chan, S.K. Yuen, M.M.F. Lam, D.C.C. Teng, A.
Copyright Year	2000
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China (Chung, P.W.K.)
Abstract	Plastic integrated circuit packages can fail due to delamination between the interfaces of the different materials. The adhesion properties across the interface of the epoxy encapsulant and the substrate are important to package reliability. The button shear test is one of the standard tests carried out to evaluate the interfacial adhesion material properties. This paper presents a method to derive a criterion for interfacial delamination using the result of the button shear test. A series of button shear tests was conducted to evaluate the adhesion properties of epoxy molding compounds (EMCs) on copper substrates. In each of the tests, the critical load acting on the EMC of the button shear sample was measured at different shear heights and a finite element model was used to evaluate the stresses at the interface between the mold compound and the copper substrate. The distortional and hydrostatic strain energy densities across the interface were also calculated. The test was also applied to a range of EMC materials. The distortional energy was found to have a linear relationship with the square of the fracture load and the EMC's Young's modulus. The hydrostatic energy was also found to have a similar but marginally different relationship with those terms. The result of the energy densities across the interface at different shear heights was also reviewed. Based on these observations, a delamination criterion was developed which includes the ratio of the distortional and hydrostatic energy density. The delamination criterion is to be tested on packages under thermal loading.
Starting Page	201
Ending Page	205
File Size	514557
Page Count	5
File Format	PDF
ISBN	0780366549
DOI	10.1109/EMAP.2000.904155
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-11-30
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Electromagnetic compatibility Adhesives Materials testing Circuit testing Copper Plastic integrated circuit packaging Integrated circuit packaging Integrated circuit reliability Material properties
Content Type	Text
Resource Type	Article

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