NDLI: Low cost molded packaging for optical data links

Content Provider	IEEE Xplore Digital Library
Author	Robinson, S.D. Acarlar, M.S. Chen, Y.C. Manzione, L.T. Shevchuk, G.J. Stefanik, D.
Copyright Year	1994
Description	Author affiliation: AT&T Bell Labs., Breinigsville, PA, USA (Robinson, S.D.; Acarlar, M.S.; Chen, Y.C.; Manzione, L.T.; Shevchuk, G.J.; Stefanik, D.)
Abstract	In order to lower the cost of optical data link packaging, a new technology has been developed which integrates optical and electrical components in a single, sealed, transfer molded package. This technology utilizes leadframes for low cost and mass handling. Overmolding is used for package sealing and optical port alignment. A unique process, two step transfer molding, allows for internal shielding, intermediate IC testing, ease of assembly and IC package sealing. An injection molded outer housing is used for connector insertion and external shielding (through the use of conductive plastics). The first application of this technology is a high performance optical transceiver package for the growing FDDI market (125 MB/s). With a duplex MIC connector, this package conforms to an industry standard outline and pinout. The optical transceiver easily meets full FDDI specifications. The design integrates an LED, PIN, transmitter IC, receiver IC and two capacitors in a single, overmolded package. The final assembly sequence was conceived using the latest Design For Simplicity (DFS) principles. This paper describes the design concept and prototype model performance results.<>
Starting Page	312
Ending Page	316
File Size	543813
Page Count	5
File Format	PDF
ISBN	0780309146
DOI	10.1109/ECTC.1994.367572
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-05-01
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Optical receivers Optical transmitters Integrated optics Optical devices Assembly Integrated circuit packaging Connectors Transceivers FDDI
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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