NDLI: 3D Integration Using Self-Assembly at Air-Water-Solid Interface

Content Provider	IEEE Xplore Digital Library
Author	Kwang Soon Park Varel, C. Ji Hao Hoo Baskaran, R. Böhringer, K.F.
Copyright Year	1992
Abstract	This paper presents the first proof-of-concept 3D integration using fluidic self-assembly of chip-scale parts (2000 × 2000 ×100 μm³ ) at an air-water-solid interface. Four-layer 3D integration is achieved by assembling new parts over previously assembled parts. Assembly proceeds as an assembly substrate is pulled up through an air-water interface and electrical and mechanical bonding are achieved by solder reflow. Magnetic fields and temporary Faraday waves are introduced for one-to-one part-to-site registration in proper orientation. The alignment accuracy degrades with increasing number of layers due to weaker magnetic force. The maximum number of layers that can be achieved is simulated and analyzed. Via resistance including the effect of degradation of solder over repeated reflow process is measured.
Sponsorship	IEEE Electron Devices Society American Society of Mechanical Engineering (ASME)
Starting Page	579
Ending Page	584
Page Count	6
File Size	1116174
File Format	PDF
ISSN	10577157
Volume Number	23
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-01-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Magnetic forces Three-dimensional displays Substrates Through-silicon vias Gold Self-assembly packaging. Fluidic self-assembly 3D integration 3D packaging packaging
Content Type	Text
Resource Type	Article
Subject	Mechanical Engineering Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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