NDLI: Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Content Provider	IEEE Xplore Digital Library
Author	Myung Jin Yim In Ho Jeong Hyung-Kyu Choi Jin-Sang Hwang Jin-Yong Ahn Woonseong Kwon Kyung-Wook Paik
Copyright Year	1999
Abstract	Anisotropic conductive adhesives (ACAs) are as promising interconnect materials for flip chip assembly in low cost, high-density, high-speed interconnection packages. We evaluated and compared several flip chip interconnects that use ACAs at the radio frequency (RF) and high-frequency range. The performance of high-speed circuits is limited by the package interconnect discontinuity which is due to large inductance and resistance in the high-frequency range. This discontinuity is determined by the interconnection geometry and materials used. For bumps on the integrated circuit (IC), we used Au studs, Au electroplated and electroless Ni/Au bumps, for the interconnection adhesives, we used two kinds of anisotropic conductive film (ACF) with a different dielectric constant. To evaluate the high frequency model parameters, which we based on an ACF flip chip model and network analysis, we took the high-frequency measurements of test flip chip vehicles that used different bonding materials. Furthermore, to demonstrate real applications for an ACF interconnection at the RF and high-frequency range, we applied ACF flip chip technologies to assemble a passive device that uses an RF integrated passive device. We also applied these technologies to an active device that uses a highly integrated monolithic microwave (IC) device on an RF module. Moreover, we compared the high-frequency characteristics of these devices with those of flip chip assemblies fabricated with conventional methods such as solder ball interconnection.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	789
Ending Page	796
Page Count	8
File Size	1122326
File Format	PDF
ISSN	15213331
Volume Number	28
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flip chip Anisotropic magnetoresistance Conductive adhesives Radio frequency Integrated circuit interconnections Conducting materials Assembly Gold Packaging Dielectric materials reliability Anisotropic conductive film (ACF) flip chip high-frequency
Content Type	Text
Resource Type	Article

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