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A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

Content Provider	IEEE Xplore Digital Library
Author	Kun-Mo Chu Jung-Sub Lee Han Seo Cho Hyo-Hoon Park Duk Young Jeon
Copyright Year	1999
Abstract	Alloys of lead-tin system are the most common solder alloys used today. However, there are environmental and health issues concerning the toxicity of lead present in these lead-tin solder alloys. Also, the flux residue removal is mandatory and leads to environmental threats. More importantly, the use of flux may contaminate the optically active surface by organic residue leftover, and a conventional cleaning method may not be effective for optoelectronic assemblies. Therefore, it is necessary to look for fluxless soldering processes for soldering optoelectronic systems. In the present study, we have conducted low-temperature flip-chip bonding of vertical-cavity surface-emitting laser (VCSEL) arrays on a glass substrate that provides propagation paths of laser beams and also supports a polymeric waveguide. Considering both the die shear test and the spreading test, the appropriate bonding temperature and pressure using indium solder bump were found to be about 150/spl deg/C/500 gf. The fracture occured between the indium solder bump and the VCSEL chip pad during the die shear test. It is inferred that both the low bonding temperature and the oxide layer which is formed on the surface of the indium solder prevented the bump from interacting with the chip pad. We expect the thin silver layer coating on the indium bump to protect the inner indium solder from oxidation and to decrease the melting temperature of the indium solder. Thus, we try coating a thin silver layer onto the indium surface. An eutectic reaction occurs at 97 wt.% of In with an eutectic point of 144/spl deg/C and the outer silver layer interacts with indium to form a AgIn/sub 2/ compound layer due to the high interdiffusion coefficient. As a result, the thin silver layer coated on the solder bump is very effective to enhance the adhesion strength between the indium bump and the VCSEL chip pads by decreasing the melting temperature of the indium solder bump locally.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society International Microelectronics Assembly and Packaging Society (IMAPS)
Starting Page	246
Ending Page	253
Page Count	8
File Size	2371135
File Format	PDF
ISSN	1521334X
Volume Number	27
Issue Number	4
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-10-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Vertical cavity surface emitting lasers Indium Lead Optical surface waves Temperature Silver Testing Surface contamination Soldering vertical-cavity surface-emitting laser (VCSEL) Flip-chip fluxless indium bump silver
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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