NDLI: SHEWMA: an end-of-line SPC scheme using wafer acceptance test data

Content Provider	IEEE Xplore Digital Library
Author	Chih-Min Fan Ruey-Shan Guo Shi-Chung Chang Chih-Shih Wei
Copyright Year	1988
Abstract	In this paper, an end-of-line quality control scheme based on wafer acceptance test (WAT) data is presented. Due to the multiple-stream and sequence-disorder effects typically present in the WAT data, an abnormal process shift caused by one machine at an in-line step may become vague for detection using end-of-line WAT data. A methodology for generating robust design parameters for the simultaneous application of Shewhart and EWMA control charts to WAT data is proposed. This SHEWMA scheme is implemented in a foundry environment and its detection and diagnosis-enhancing capabilities are validated using both numerical derivations and fab data. Results show that the SHEWMA scheme is superior to the current practices in detection speed. Its use is complementary to the existing in-line SPC for process integration.
Sponsorship	IEEE Electron Devices Society IEEE Components, Packaging, and Manufacturing Technology Society IEEE Reliability Society IEEE Solid-State Circuits Society
Starting Page	344
Ending Page	358
Page Count	15
File Size	363080
File Format	PDF
ISSN	08946507
Volume Number	13
Issue Number	3
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-08-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Quality control Fabrication Circuit testing Control charts Semiconductor device manufacture Manufacturing processes Process control Stability Analysis of variance Robust control
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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