NDLI: Thermal Needs and Challenges for the Solid State Lighting Devices: Materials to Packages

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Arik, Mehmet Weaver, Stanton Setlur, Anant Haitko, Deborah
Copyright Year	2005
Abstract	Light emitting diodes historically have been used for indicators and produced low amounts of heat. The introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards specialty and general illumination applications. The increased electrical currents used to drive the LEDs have focused more attention on the thermal paths in the LED packages and developments in LED power packaging. The luminous efficiency of LEDs is soon expected to reach over 80 Lumens/Watt that is approximately 6 times more than a conventional tungsten bulb. The thermal challenges include but not limited to chip architecture, packaging, phosphors for light conversion, encapsulants and fillers for optical transparency, interconnects for both electrical and thermal reasons. A typical LED power-package has a 1mm2 surface area with a total heat generation of 1 W. This corresponds to a heat flux of 100 W/cm2, which is much higher than heat fluxes at the current electronics packaging. In this paper, effect of the thermal management on packaging architectures, as well as phosphor and encapsulants are discussed. Discussions on the microscopic defects due to packaging problems as well as chip active layer defects are presented through experimental findings.
Sponsorship	Electronic and Photonic Packaging Division
Starting Page	459
Ending Page	466
Page Count	8
File Format	PDF
ISBN	0791842177
DOI	10.1115/IMECE2005-79330
e-ISBN	0791837696
Volume Number	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Conference Proceedings	ASME 2005 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2005-11-05
Publisher Place	Orlando, Florida, USA
Access Restriction	Subscribed
Subject Keyword	Transparency Architecture Fillers (materials) Brightness (photometry) Light-emitting diodes Heat flux Heat Phosphors Electronic packaging Tungsten Packaging Flux (metallurgy) Thermal management Electric current
Content Type	Text
Resource Type	Article

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