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Content Provider | IEEE Xplore Digital Library |
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Author | Enchao Yu DeMing Wang Sura Kim Przekwas, A. |
Copyright Year | 2000 |
Description | Author affiliation: CFD Res. Corp., Huntsville, AL, USA (Enchao Yu) |
Abstract | In this paper we present a new integrated thermo-electric-fluidic cooler (TEFC). This device is essentially composed of a low dimensional thermoelectric heat pump and a miniature fluidic loop in a highly integrated architecture. Heat removal is enhanced by micro-fin structures in the microchannels on the hot side of the thermoelectric device. Discussions are focused on the conceptual design of the TEFC and numerical models for the thermoelectric, and fluidic circuits. Simulation results on modeling of refrigeration loop are presented. Also different substrate materials are evaluated for improved heat spreading. Microchannels in both diamond and copper blocks are found to effectively remove heat and keep a more uniform temperature profile on the active surfaces than in CuW blocks. Fin configurations in the microchannels for enhancing liquid cooling are also evaluated. Preliminary results obtained for a TEFC device show great potentials for applications in cooling communication and mobile electronic systems. |
Starting Page | 134 |
Ending Page | 139 |
File Size | 422102 |
Page Count | 6 |
File Format | |
ISBN | 0780359127 |
ISSN | 10899870 |
DOI | 10.1109/ITHERM.2000.866182 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2000-05-23 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Cooling Optoelectronic devices Microchannel Thermoelectricity Thermoelectric devices Heat pumps Numerical models Circuit simulation Refrigeration Copper |
Content Type | Text |
Resource Type | Article |
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