NDLI: Development of novel ultra-high dielectric constant polymer based composite

Content Provider	IEEE Xplore Digital Library
Author	Yang Rao Wong, C.P.
Copyright Year	2002
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Yang Rao; Wong, C.P.)
Abstract	Embedded capacitor technology can increase silicon packing efficiency, improve electrical performance, and reduce electronic assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB) substrate for demanding wireless, RF portable telecommunication products. A novel epoxy-based composite with very ultra high dielectric constant (/spl epsiv//sub r//spl sim/1000) has been developed in this work. The previous record of /spl epsiv//sub r/=150 was only recently reported. To our best knowledge, this is the highest K value of the polymer based composite ever reported. High dielectric constant is obtained by increasing the concentration of conductive filler close to but not exceed the percolation threshold within the polymer matrix. This novel ultra high K material also has low dielectric loss (<0.02), good adhesion and perfect multi-chip-module laminate (MCM-L) process compatibility. An embedded capacitor prototype with capacitance density of 100 nF/cm/sup 2/ has been manufactured using this composite and spin coating technology. This novel composite is the perfect material candidate for the integral embedded capacitor applications for next generation electronic products.
Sponsorship	Nat. Sci. Council Ministr. Educ
Starting Page	335
Ending Page	340
File Size	243675
Page Count	6
File Format	PDF
ISBN	078037682X
DOI	10.1109/EMAP.2002.1188861
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-12-04
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric constant Polymers Capacitors High-K gate dielectrics Dielectric materials High K dielectric materials Dielectric losses Silicon Assembly Costs
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Libarray of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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